october 2010 doc id 16859 rev 2 1/8 8 ESDAULC6-8F3 8-line ultralarge bandwidth esd protection features 8-line 15 kv esd protection ultralarge bandwidth: ? no influence on signal rise and fall times ? maximized number of signal harmonics low pcb space consumption: 1.2 x 1.2 mm2 (1.44 mm2) very low leakage current: 0.1 a max high reliability offered by monolithic integration high reduction of parasitic elements through integration and wafer level packaging complies with the following standards: iec 61000-4-2 level 4: ? 15 kv (air discharge) ? 8 kv (contact discharge) iec 61000-4-2 level 1: ? 2 kv (air discharge) ? 2 kv (contact discharge) applications where transient overvoltage protection in esd sensitive equipment is required using high speed differential interfaces: mobile phones portable navigation devices portable multimedia players description the ESDAULC6-8F3 is a monolithic application specific discrete device dedicated to esd protection of high speed differential interfaces. this device is ideal for applications where both reduced print circuit board space and power absorption capability are required. figure 1. pin configuration (bump side) figure 2. schematic tm : hdmi, the hdmi logo and high-definition multimedia interface are trademarks or registered trademarks of hdmi licensing llc. leed-free flip-chip package (9 bumps) 3 2 1 a c b a1 a2 a3 b1 b2 b3 c1 c2 c3 www.st.com
characteristics ESDAULC6-8F3 2/8 doc id 16859 rev 2 1 characteristics figure 3. electrical char acteristics - definitions table 1. absolute maximum ratings (t amb = 25 c) symbol parameter value unit v pp esd iec 61000-4-2, level 4 - on all pins: air discharge contact discharge 15 15 kv t op operating temperature range -30 to + 85 c t stg storage temperature range -55 to + 150 c table 2. electrical characteristics (t amb = 25 c) symbol test condition min. typ. max. unit v br i r = 1 ma 6 10 v i rm v rm = 3 v per line 3 100 na c i/o-gnd v line = 0 v, v osc = 30 mv, f = 1 mhz 1.2 pf i v i rm i r v rm v br symbol parameter v = breakdown voltage i = leakage current @ v v = stand-off voltage i = breakdown current br rm rm rm r
ESDAULC6-8F3 characteristics doc id 16859 rev 2 3/8 figure 4. s21(db) attenuation measurement f igure 5. analog crosstalk measurements s21 (db) 300k 1.0m 3.0m 10m 30m 100m 300m 1.0g 3.0g 4.00 - 3.00 -2.00 -1.00 0.00 f(hz) crosstalk i2-o1(db) 300k 1.0m 3.0m 10m 30m 100m 300m 1.0g 3.0g -120 -90 -60 -30 0.0 f(hz) figure 6. digital crosstalk measurement figure 7. esd response to iec 61000-4-2 (+8 kv contact discharge) 500 mv/div c2 output 20 mv/div 10 ns/div 10 ns/div c3 input 50 v/div vcl 20 ns/div c2 figure 8. esd response to iec 61000-4-2 (-8 kv contact discharge) figure 9. line to ground capacitance versus applied voltage (typical values) 50 v/div 20 ns/div vcl c2 c(pf) v (v) r 1 0 0.5 2345 1.0 1.5 2.0
typical application schematic ESDAULC6-8F3 4/8 doc id 16859 rev 2 figure 10. line to ground capacitance versus applied frequency (typical values) 2 typical application schematic figure 11. implementation with hdmi type c connector c(ff) f(ghz) 1.0e-02 1.0e-01 1.0e+00 1.0e+01 0 200 400 600 800 1000 a1 a2 4 tmds channel hdmi driver a3 b1 b3 c1 c2 c3 ESDAULC6-8F3 hdmi05-cl01f3 b2 cec 5v 2 x 1k75 3v scl sda hpd 100k 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 tmds data2 shield tmds data2 + tmds data2 - tmds data1 shield tmds data1 + tmds data1 - tmds data0 shield tmds data0 + tmds data0 - tmds clk shield tmds clk + tmds clk - ddc/ eec ground cec scl sda reserved +5v power hot plug detect type c hdmi connector
ESDAULC6-8F3 ordering information scheme doc id 16859 rev 2 5/8 3 ordering information scheme figure 12. ordering information scheme 4 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 13. flip chip dimensions esda ulc 6 - 8 f3 esd array ultra low capacitance breakdown voltage number of protected lines package 6 = 6 v min. 8 = eight lines f = flip-chip 3 = lead-free, pitch 400 m 400 m 40 400 m 40 170 m 255 m 40 605 m 55 1.2 mm 30 m 1.2 mm 30 m
package information ESDAULC6-8F3 6/8 doc id 16859 rev 2 figure 16. flip chip tape and reel specification note: more packing information is av ailable in the application notes: an2348: "flip chip: package description and recommendations for use" an1751: "emi filters: recommendations and measurements" figure 14. footprint figure 15. marking copper pad diameter: 220 m recommended, 260 m max solder mask opening: 300 m minimum solder stencil opening: 220 m recommended x y x w z w dot, st logo xx = maring z = manufacturing location yww = datecode (y = year ww = week) ecopack ? grade user direction of unreeling all dimensions in mm 4.0 0.1 8.0 0.3 4.0 0.1 1.75 0.1 3.5 - 0.1 ? 1.5 0.1 0.69 0.05 1.30 1.30 dot identifyng pin a1 location st xxz yww st xxz yww st xxz yww
ESDAULC6-8F3 ordering information doc id 16859 rev 2 7/8 5 ordering information 6 revision history table 3. ordering information order code marking package weight base qty delivery mode ESDAULC6-8F3 er flip chip 1.88 mg 5000 tape and reel (7?) table 4. document revision history date revision changes 06-oct-2010 1 first issue. 15-oct-2010 2 corrected typographical error in document title.
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